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21	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:01:57 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
22	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM 3D S YS TEM INTEGRATION TS V INTERPOS ER Silicon interposers with through silicon vias (TSVs) are an important element for the realization of 3D system-in-pa Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-11 11:27:45 Materials science Wafer Three-dimensional integrated circuit Microelectromechanical systems Through-silicon via Flip chip Fraunhofer Society Die preparation Semiconductor device fabrication Microtechnology Electronics
23	qctconnect.com QUALCOMM CONFIDENTIAL AND PROPRIETARY Roadmap for Design and EDA Infrastructure for 3D Products Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:30:09 Semiconductor device fabrication Technology Three-dimensional integrated circuit Interposer Qualcomm Dynamic random-access memory Back end of line Application-specific integrated circuit Through-silicon via Integrated circuits Electronics Electronic engineering
24	FPGAs with 28Gb/s Transceivers Built with Heterogeneous Stacked-Silicon Interconnects Ephrem Wu and Suresh Ramalingam © Copyright 2012 Xilinx . Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:25:59 Integrated circuits Xilinx Semiconductor device fabrication Through-silicon via Electronic engineering Electronics Field-programmable gate array
25	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-02 11:52:26 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology
26	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-01 11:41:42 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology
27	Global Semiconductor Alliance Electrostatic Discharge (ESD) in 3D-IC Packages Version 1.0 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-01-23 15:21:51 Electrical breakdown Electrical safety Semiconductor device fabrication Electrostatics Electrostatic discharge Human-body model Three-dimensional integrated circuit Transmission-line pulse Through-silicon via Electromagnetism Integrated circuits Physics
28	SEMI® International Standards Information on 3DS-IC Activities January 2014 SEMI 3DS-IC Standards Activities Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-02-04 09:46:57 Technology Three-dimensional integrated circuit Wafer Applied Materials SUSS MicroTec Metrology 3DS Through-silicon via Semiconductor device fabrication Microtechnology Electronics
29	Next Generation Stacked Memory Systems Alok Gupta NVIDIA, Santa Clara, CA 1 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-01-23 15:54:47 Dynamic random-access memory Electronic engineering Interposer Semiconductor device fabrication Technology Through-silicon via Computer memory Integrated circuits Electronics
30	Microsoft PowerPoint - Standards Related to 3D Packaging (Jasbir Bath, IPC) [Compatibility Mode] Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-02-04 09:46:57 Electronics Three-dimensional integrated circuit Wafer Packaging and labeling Integrated circuit packaging Through-silicon via Semiconductor device fabrication Technology Microtechnology

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